Thick film power resistor with thick printed copper terminals

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F17%3A43932349" target="_blank" >RIV/49777513:23220/17:43932349 - isvavai.cz</a>

Result on the web

<a href="http://passive-components.eu/thick-film-power-resistor-with-thick-printed-copper-terminals/" target="_blank" >http://passive-components.eu/thick-film-power-resistor-with-thick-printed-copper-terminals/</a>

DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Thick film power resistor with thick printed copper terminals

Original language description

This paper is focused on the thick film power resistors with copper terminals. These terminals are manufactured by the new Thick Printed Copper (TPC) technology. This technology is based on sequential screen printing and firing of copper paste in nitrogen atmosphere on alumina substrate. TPC technology is predominantly used for power electronic substrates manufacturing. Themajor trends of power electronics are continual miniaturization and power increasing. Itbrings increased requirements on electronic components particularly in terms of heat dissipation. Thick film power resistor with copper terminals represents potential replacement of standard wirewound power resistors and allows direct integration of resistors on TPC substrates. Printed resistors on TPC substrates can be supplemented with discrete electronic components which creates the possibility to realize truly complex power electronic circuits. The direct integration of printed components is not possible in case of standard Direct Bonded Copper (DBC) technology. The main benefits of printed resistors based on TPC technology are its low thickness and good therrnaí conductivity. The low thickness of resistors is important for miniaturization of final electronic devices. The resistor main electrical parameters (temperature coefficient of resistance, temperature coefficient and nominal resistance value affer aging by dry heat test, insulation resistance, dielectric strength etc.) are described in this paper.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

Result was created during the realization of more than one project. More information in the Projects tab.

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2017

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

PCNS Passive Components Networking Days Proceedings

ISBN

978-80-905768-8-9

ISSN

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e-ISSN

neuvedeno

Number of pages

5

Pages from-to

137-141

Publisher name

Vysoké učení technické v Brně

Place of publication

Brno

Event location

Brno, Czech Republic

Event date

Sep 12, 2017

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

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