Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F21%3APU141662" target="_blank" >RIV/00216305:26220/21:PU141662 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9467519" target="_blank" >https://ieeexplore.ieee.org/document/9467519</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467626" target="_blank" >10.1109/ISSE51996.2021.9467626</a>
Alternative languages
Result language
angličtina
Original language name
Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure
Original language description
This article deals with the possibilities of representing the detail of solder ball inner structure more precisely using two methods of sample preparation. The first method of sample preparation is standard metallographic microsection with grinding and polishing with diamond paste with a grain size up to 0.25 μm. The second method is the microsection of the BGA (ball grid array) ball using FIB (focused ion beam) technology. Both technologies contain disadvantages in examining the detail of the solder structure. Scratches are a common problem for grinding and polishing which are caused by the smallest grain in the polishing paste. The FIB technology is designed for a smaller sample rather than a BGA ball. Using this technology, the curtain can be caused by an ion beam. This research is mainly concerned with the comparison of these technologies with emphasis on the possibility of losing information when processing samples.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2021 44th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-6654-1477-7
ISSN
2161-2536
e-ISSN
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Number of pages
4
Pages from-to
1-4
Publisher name
IEEE
Place of publication
neuveden
Event location
Bautzen
Event date
May 5, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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