Advances in FIB-SEM Analysis of TSV and Solder Bumps—Approaching Higher Precision, Throughput, and Comprehensiveness

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F01733214%3A_____%2F14%3A00000006" target="_blank" >RIV/01733214:_____/14:00000006 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Advances in FIB-SEM Analysis of TSV and Solder Bumps—Approaching Higher Precision, Throughput, and Comprehensiveness

Original language description

Cross sections of large Through Silicon Vias (TSV) and solder bumps are often prepared using the Focused Ion Beam (FIB). The high current Xe plasma ion source allows fast and precise target preparation of TSV with small diameter. Solder bumps can be accessed due to the high milling rate too. However, thehigh current milling by plasma FIB causes the worsening ofthe milled surface quality. An optimized FIB scanning stratégy accompanied with the novel rocking stage for the sample tilting during the milling has been developed for the plasma FIB. Whole milling process is observed by the Scanning Electron Microscopy (SEM). Time to prepare a cross section is accelerated and the excellent quality is suitable for subsequent failure analysis. Also important is proper sample cleaving before FIB milling. Using an accurate method to cleave the sample prior to FIB preparation further reduces the overall sample preparation time. The high quality cross sections prepared using this new method are ready not only for SEM but also for EDX and EBSD analysis, either 2D or 3D, when combined with FIB slicing. Broadening the analysis to these techniques increases the obtainable information, allowing the arrangement of materials and their crystalline structure to be studied in a detail.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

<a href="/en/project/TE01020233" target="_blank" >TE01020233: Advanced Microscopy and Spectroscopy Platform for Research and Development in Nano and Microtechnologies - AMISPEC</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2014

Confidentiality

C - Předmět řešení projektu podléhá obchodnímu tajemství (§ 504 Občanského zákoníku), ale název projektu, cíle projektu a u ukončeného nebo zastaveného projektu zhodnocení výsledku řešení projektu (údaje P03, P04, P15, P19, P29, PN8) dodané do CEP, jsou upraveny tak, aby byly zveřejnitelné.

Article name in the collection

ISTFA 2014: Proceedings of the 40th International Symposium for Testing and Failure Analysis

ISBN

9781627080743

ISSN

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e-ISSN

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Number of pages

7

Pages from-to

136-142

Publisher name

ASM International

Place of publication

Houston

Event location

Houston

Event date

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Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

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