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Advances in FIB-SEM Analysis of TSV and Solder Bumps—Approaching Higher Precision, Throughput, and Comprehensiveness

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F01733214%3A_____%2F14%3A00000006" target="_blank" >RIV/01733214:_____/14:00000006 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Advances in FIB-SEM Analysis of TSV and Solder Bumps—Approaching Higher Precision, Throughput, and Comprehensiveness

  • Original language description

    Cross sections of large Through Silicon Vias (TSV) and solder bumps are often prepared using the Focused Ion Beam (FIB). The high current Xe plasma ion source allows fast and precise target preparation of TSV with small diameter. Solder bumps can be accessed due to the high milling rate too. However, thehigh current milling by plasma FIB causes the worsening ofthe milled surface quality. An optimized FIB scanning stratégy accompanied with the novel rocking stage for the sample tilting during the milling has been developed for the plasma FIB. Whole milling process is observed by the Scanning Electron Microscopy (SEM). Time to prepare a cross section is accelerated and the excellent quality is suitable for subsequent failure analysis. Also important is proper sample cleaving before FIB milling. Using an accurate method to cleave the sample prior to FIB preparation further reduces the overall sample preparation time. The high quality cross sections prepared using this new method are ready not only for SEM but also for EDX and EBSD analysis, either 2D or 3D, when combined with FIB slicing. Broadening the analysis to these techniques increases the obtainable information, allowing the arrangement of materials and their crystalline structure to be studied in a detail.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

    <a href="/en/project/TE01020233" target="_blank" >TE01020233: Advanced Microscopy and Spectroscopy Platform for Research and Development in Nano and Microtechnologies - AMISPEC</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Others

  • Publication year

    2014

  • Confidentiality

    C - Předmět řešení projektu podléhá obchodnímu tajemství (§ 504 Občanského zákoníku), ale název projektu, cíle projektu a u ukončeného nebo zastaveného projektu zhodnocení výsledku řešení projektu (údaje P03, P04, P15, P19, P29, PN8) dodané do CEP, jsou upraveny tak, aby byly zveřejnitelné.

Data specific for result type

  • Article name in the collection

    ISTFA 2014: Proceedings of the 40th International Symposium for Testing and Failure Analysis

  • ISBN

    9781627080743

  • ISSN

  • e-ISSN

  • Number of pages

    7

  • Pages from-to

    136-142

  • Publisher name

    ASM International

  • Place of publication

    Houston

  • Event location

    Houston

  • Event date

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article