How to achieve artefact-free FIB milling on polyimide packages

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F01733214%3A_____%2F16%3AN0000005" target="_blank" >RIV/01733214:_____/16:N0000005 - isvavai.cz</a>
Result on the web
<a href="https://asm.confex.com/asm/istfa16/webprogram/Paper42339.html" target="_blank" >https://asm.confex.com/asm/istfa16/webprogram/Paper42339.html</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
How to achieve artefact-free FIB milling on polyimide packages
Original language description
The Focused Ion Beam (FIB) and the Scanning Electron Microscopy (SEM) are essential techniques for failure analysis of microelectronic devices. FIB is used for cross-sectioning the sample by ion milling and SEM is used for high resolution imaging of resulting cross sections, for charge compensation, or as a source of electrons for other analytical techniques. Two parameters of the cross-sectioning are crucial – the fast milling rate and the high quality of the surface, with no damage or artefacts obstructing the failure analysis process. The cross section quality is usually improved by polishing it from several directions, which have been demonstrated on large Through Silicon Vias (TSV) samples to mitigate the curtaining effect. Unfortunately this method makes cross-sectioning more difficult and less accurate. To overcome this drawback, an improved method has been developed by using multi-tilt sample stage (so-called Rocking stage). It allows an additional tilting also in the plane of the cross section which enables SEM observation of the process simultaneously. The workflow will be described in detail (mask fabrication, nanomanipulator tip attachment, sample placement, FIB cross section) and the comparison to classical approach by Ga FIB will be shown.
Czech name
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Czech description
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Project
<a href="/en/project/TE01020233" target="_blank" >TE01020233: Advanced Microscopy and Spectroscopy Platform for Research and Development in Nano and Microtechnologies - AMISPEC</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
ISTFA 2016: Proceedings of the 42nd International Symposium for Testing and Failure Analysis
ISBN
9781627081351
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
“nestrankovano”
Publisher name
ASM International
Place of publication
Fort Worth
Event location
Fort Worth
Event date
Jan 1, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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