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A 650 kV/mu s Common-Mode Resilient CMOS Galvanically Isolated Communication System

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F22%3APU147389" target="_blank" >RIV/00216305:26220/22:PU147389 - isvavai.cz</a>

  • Result on the web

    <a href="https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9626774" target="_blank" >https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9626774</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/TCSI.2021.3124554" target="_blank" >10.1109/TCSI.2021.3124554</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    A 650 kV/mu s Common-Mode Resilient CMOS Galvanically Isolated Communication System

  • Original language description

    This work presents a galvanically isolated chip-to-chip communication system that utilizes laterally coupled resonators in combination with a new differential full-wave receiver architecture. Lateral resonant coupling increases the isolation capability and significantly minimizes the intra-chip coupling capacitance of galvanic isolators beyond the limits of vertical coupling in standard CMOS. The presented system marries the merits of a laterally resonant coupled channel with a source-gate coupled low-power, low-latency RF detector architecture that enables high common-mode and differential noise immunity. A center-tapped transformer is used as the interface between the proposed fully differential receiver and the communication channel to further enhance the common-mode transient immunity (CMTI). The proposed system is integrated in a 0.25 mu m CMOS process with four metal layers and does not alter the native process or necessitate additional fabrication steps. The design does not require exotic packaging and achieves state-of-art CMTI of 650 kV/mu s at 5 kVpk isolation, sub-20ns propagation delay, and maintains a small form-factor of 0.95 mm(2). The GI system exhibits robust performance to fabrication variations, with less than +/- 0.3% and +/- 8% sensitivity to process variation and post-assembly chip distance offset, respectively.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database

  • CEP classification

  • OECD FORD branch

    20200 - Electrical engineering, Electronic engineering, Information engineering

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2022

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS

  • ISSN

    1549-8328

  • e-ISSN

    1558-0806

  • Volume of the periodical

    69

  • Issue of the periodical within the volume

    2

  • Country of publishing house

    US - UNITED STATES

  • Number of pages

    12

  • Pages from-to

    587-598

  • UT code for WoS article

    000732244000001

  • EID of the result in the Scopus database

    2-s2.0-85120578260