Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26310%2F09%3APU84444" target="_blank" >RIV/00216305:26310/09:PU84444 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—
Alternative languages
Result language
angličtina
Original language name
Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques
Original language description
A plasma-polymerized tetravinylsilane film of about 1 micron thickness was prepared under steady-state deposition conditions on polished silicon wafer using plasma-enhanced chemical vapor deposition. Near-surface mechanical properties such as the reducedmodulus and hardness of the plasma polymer film were investigated using the conventional depth-sensing nanoindentation technique as well as the load-partial-unload (cyclic) nanoindentation technique. The study found an influence of the dwell time and loading/unloading rate on the determined values of the reduced modulus, hardness, and contact depth.
Czech name
—
Czech description
—
Classification
Type
O - Miscellaneous
CEP classification
CF - Physical chemistry and theoretical chemistry
OECD FORD branch
—
Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů