Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26310%2F10%3APU90072" target="_blank" >RIV/00216305:26310/10:PU90072 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques
Original language description
A plasma-polymerized tetravinylsilane film of about 1 micron thickness was prepared under steady-state deposition conditions on polished silicon wafer using plasma-enhanced chemical vapor deposition. Near-surface mechanical properties such as the reducedmodulus and hardness of the plasma polymer film were investigated using conventional depth-sensing nanoindentation as well as load-partial-unload (cyclic) nanoindentation. The study found an influence of the dwell time and loading/unloading rate on thedetermined values of the reduced modulus, hardness, and contact depth.
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
CF - Physical chemistry and theoretical chemistry
OECD FORD branch
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Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Surface and Coatings Technology
ISSN
0257-8972
e-ISSN
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Volume of the periodical
205
Issue of the periodical within the volume
Suppl 1
Country of publishing house
CZ - CZECH REPUBLIC
Number of pages
4
Pages from-to
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UT code for WoS article
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EID of the result in the Scopus database
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