State-of-the-Art Electronic Materials for Thin Films in Bioelectronics

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26620%2F23%3APU149028" target="_blank" >RIV/00216305:26620/23:PU149028 - isvavai.cz</a>

Result on the web

<a href="https://onlinelibrary.wiley.com/doi/10.1002/aelm.202300258" target="_blank" >https://onlinelibrary.wiley.com/doi/10.1002/aelm.202300258</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1002/aelm.202300258" target="_blank" >10.1002/aelm.202300258</a>

Result language

angličtina

Original language name

State-of-the-Art Electronic Materials for Thin Films in Bioelectronics

Original language description

This review is dedicated to electronics materials enabling thin-film-based neural interface and bioelectronics devices. First-generation bioelectronic medicine devices feature hand-crafted bulk interface electrodes, wires and interconnects, and insulators. This review discusses how modern materials science, especially know-how repurposed from semiconductor and microdevice technologies, enables next-generation bioelectronics. Those are divided into two subgroups: second and third generation. The former refers to rigid microscaled devices, while the latter is defined as soft, ultrathin, and flexible microdevices. A critical assessment of different biointerface electrodes, conductors for interconnects, and insulators for substrates, passivation, and encapsulation layers is made. The goal is not to give an exhaustive account of every use-example of given materials, but to point out specific aspects that are relevant to making the right choices for materials for a given device or application. Unique advantages of specific materials are highlighted, while also focusing on weaker points and caveats that those materials may have. The goal is to have an up-to-date handbook for persons entering the field which also points out tips and tricks as well as challenging problems that researchers can be inspired to confront and overcome.

Czech name

—

Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

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OECD FORD branch

21000 - Nano-technology

Project

Result was created during the realization of more than one project. More information in the Projects tab.

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2023

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Advanced Electronic Materials

ISSN

2199-160X

e-ISSN

—

Volume of the periodical

9

Issue of the periodical within the volume

8

Country of publishing house

DE - GERMANY

Number of pages

23

Pages from-to

1-23

UT code for WoS article

001024523900001

EID of the result in the Scopus database

2-s2.0-85164117301