Precision Xe Plasma FIB Delayering for Physical Failure Analysis of sub-20 nm Microprocessor Devices

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F01733214%3A_____%2F17%3AN0000004" target="_blank" >RIV/01733214:_____/17:N0000004 - isvavai.cz</a>

Result on the web

<a href="https://asm.confex.com/asm/istfa17/webprogram/Paper44251.html" target="_blank" >https://asm.confex.com/asm/istfa17/webprogram/Paper44251.html</a>

DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Precision Xe Plasma FIB Delayering for Physical Failure Analysis of sub-20 nm Microprocessor Devices

Original language description

Deprocessing is an essential step in the physical failure analysis of ICs. Typically this is accomplished by techniques such as wet chemical methods, RIE and mechanical manual polishing. Manual polishing suffers from highly non-uniform delayering particularly for sub-20nm technologies due to aggressive back-end-of-line (BEOL) scaling and porous ultra low-k dielectric films. Recently gas assisted Xe plasma FIB has demonstrated uniform delayering of the metal and dielectric layers achieving a planar surface of heterogeneous materials. In this paper, we present the successful application of this technique to delayer sub-20 nm microprocessor chips with real defects to root cause the failure.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

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OECD FORD branch

21002 - Nano-processes (applications on nano-scale); (biomaterials to be 2.9)

Project

<a href="/en/project/TE01020233" target="_blank" >TE01020233: Advanced Microscopy and Spectroscopy Platform for Research and Development in Nano and Microtechnologies - AMISPEC</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2017

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis

ISBN

978-1-62708-150-4

ISSN

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e-ISSN

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Number of pages

6

Pages from-to

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Publisher name

ASM International

Place of publication

Pasadena

Event location

Pasadena

Event date

Jan 1, 2017

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

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