Improvement of Top-down Delayering Techniques on Advanced Technology Nodes

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F01733214%3A_____%2F16%3AN0000003" target="_blank" >RIV/01733214:_____/16:N0000003 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/document/7564253/" target="_blank" >http://ieeexplore.ieee.org/document/7564253/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/IPFA.2016.7564253" target="_blank" >10.1109/IPFA.2016.7564253</a>

Result language
angličtina
Original language name
Improvement of Top-down Delayering Techniques on Advanced Technology Nodes
Original language description
An improved method of a planar IC sample delayering by FIB is proposed. The sample cleaving and FIB milling from two directions increases the quality of the delayered area. SEM allows accurate endpointing of the delayering on the layer of interest. The method allows to increase the delayered sample area significantly.
Czech name
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Czech description
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Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Project
<a href="/en/project/TE01020233" target="_blank" >TE01020233: Advanced Microscopy and Spectroscopy Platform for Research and Development in Nano and Microtechnologies - AMISPEC</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
ISSN
1946-1550
e-ISSN
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Volume of the periodical
“neuveden”
Issue of the periodical within the volume
July 2106
Country of publishing house
US - UNITED STATES
Number of pages
5
Pages from-to
81-85
UT code for WoS article
000389243200019
EID of the result in the Scopus database
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