Novel applications of and solutions in the SOI technology
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F26821532%3A_____%2F15%3A%230000094" target="_blank" >RIV/26821532:_____/15:#0000094 - isvavai.cz</a>
Result on the web
<a href="http://dms.fzu.cz/" target="_blank" >http://dms.fzu.cz/</a>
DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Novel applications of and solutions in the SOI technology
Original language description
The BGSOI technology (Direct Bond and Grind-back SOI) - the basic method of making SOI wafers ? will do the trick for reasonable price. After wafer bonding and bond strengthening annealing, the material of the device wafer is removed by means of mechanical grinding and the surface of the final device layer is finished by polishing. The typically achievable uniformity of the device layer thickness is +/- 0.5 ?m. The material of the supporting wafer is removed by Taiko grinding and silicon etching and theburied oxide is removed by HF etching. The resulting die thickness keeps the exceptional thickness uniformity of BGSOI, which is an order of magnitude better compared to conventional variability of Taiko grinding (> +/- 5.0 ?m) used with conventional process of device manufacturing. Novel solutions of aspects specific for SOI are discussed as well. These include gettering and stress engineering.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JJ - Other materials
OECD FORD branch
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Result continuities
Project
<a href="/en/project/TH01010419" target="_blank" >TH01010419: Development of Novel Technologies for Trench Insulated Gate Bipolar Transistors (TIGBT) Manufacturing</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
DEVELOPMENT OF MATERIALS SCIENCE IN RESEARCH AND EDUCATION - BOOK OF ABSTRACTS OF THE 25 th JOINT SEMINAR
ISBN
978-80-89597-28-4
ISSN
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e-ISSN
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Number of pages
66
Pages from-to
44
Publisher name
Slovak Expert Group of Solid State Chemistry and Physics
Place of publication
Kezmarske Zlaby (SK)
Event location
Kezmarske Zlaby (SK)
Event date
Aug 31, 2015
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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