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Influence of mechanical strength of electrically conductive sticking joint on its resistance

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F02%3A00000245" target="_blank" >RIV/49777513:23220/02:00000245 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Influence of mechanical strength of electrically conductive sticking joint on its resistance

  • Original language description

    Paper dealts with electrically conductive adhesives, that are one from possible substitutes of lead solder in electronic assembly. These adhesives are mostly made up by mixture of conductive particles and resin. One of conductive mechanisms, what assertsin these adhesives, is just contact between conductive particles. Quality of this contact is among others dependent on inner stress in adhesive. Resins used for this type of adhesives of course age and especially humidity is unfriendly for them, thanksto moistening. Ageing approves also by change of mechanical strenght of sticking joint and thereby even before refering inner stress. Decrease of inner stress then reduce pressure force between individual particles and adhesive force, and thereby resistivity raise. At the end it will be presented measured value obtained at experiments.

  • Czech name

    Vliv mechanické pevnosti elektricky vodivého lepeného spoje na jeho rezistivitu

  • Czech description

    Příspěvek pojednává o elektricky vodivých lepidlech, které jsou jednou z možných náhrad olovnaté pájky v elektronické montáži. Tato lepidla jsou vyrobena jako směs vodivých částic a pojiva (pryskyřice). Vnitřní pnutí pojiva vytváří vodivé spojení mezi částicemi. Stárnutím dochází ke změně vnitřního pnutí a tím je samozřejmě ovlivněna i rezistivita vodivého lepidla.

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2002

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    European microelectronics packaging & interconnection symposium

  • ISBN

    83-904462-7-8

  • ISSN

  • e-ISSN

  • Number of pages

    3

  • Pages from-to

    403-405

  • Publisher name

    IMAPS - Poland Chapter

  • Place of publication

    Cracow

  • Event location

    Krakov

  • Event date

    Jan 1, 2002

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article