Influence of mechanical strength of electrically conductive sticking joint on its resistance
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F02%3A00000245" target="_blank" >RIV/49777513:23220/02:00000245 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Influence of mechanical strength of electrically conductive sticking joint on its resistance
Original language description
Paper dealts with electrically conductive adhesives, that are one from possible substitutes of lead solder in electronic assembly. These adhesives are mostly made up by mixture of conductive particles and resin. One of conductive mechanisms, what assertsin these adhesives, is just contact between conductive particles. Quality of this contact is among others dependent on inner stress in adhesive. Resins used for this type of adhesives of course age and especially humidity is unfriendly for them, thanksto moistening. Ageing approves also by change of mechanical strenght of sticking joint and thereby even before refering inner stress. Decrease of inner stress then reduce pressure force between individual particles and adhesive force, and thereby resistivity raise. At the end it will be presented measured value obtained at experiments.
Czech name
Vliv mechanické pevnosti elektricky vodivého lepeného spoje na jeho rezistivitu
Czech description
Příspěvek pojednává o elektricky vodivých lepidlech, které jsou jednou z možných náhrad olovnaté pájky v elektronické montáži. Tato lepidla jsou vyrobena jako směs vodivých částic a pojiva (pryskyřice). Vnitřní pnutí pojiva vytváří vodivé spojení mezi částicemi. Stárnutím dochází ke změně vnitřního pnutí a tím je samozřejmě ovlivněna i rezistivita vodivého lepidla.
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2002
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
European microelectronics packaging & interconnection symposium
ISBN
83-904462-7-8
ISSN
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e-ISSN
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Number of pages
3
Pages from-to
403-405
Publisher name
IMAPS - Poland Chapter
Place of publication
Cracow
Event location
Krakov
Event date
Jan 1, 2002
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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