Failure Modes of Solder Interconnections under Mechanical Shock Loading at Elevated Temperaturs

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F06%3A00000281" target="_blank" >RIV/49777513:23220/06:00000281 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—

Result language
angličtina
Original language name
Failure Modes of Solder Interconnections under Mechanical Shock Loading at Elevated Temperaturs
Original language description
Portable equipment are primarily exposed to local temperature fluctuations by internally generated heat dissipation as well as to mechanical shock loadings due to accidental droppings. The reliability of test boards was studied under mechanical shock loadings at elevated temperatures. Component boards were loaded by using a high amplitude (high-frequency) vibration tester because very similar loading conditions can be produced with the vibration tester as compared to the JESD22-B111 type drop tester with much less time and effort. The same experimental design was repeated with the JESD22-B111 drop tested to conform that the failure modes and mechanism are equal. The leadfree materials used in the reliability tests were chosen to represent those typically used in portable electronic products.
Czech name
Failure Modes of Solder Interconnections under Mechanical Shock Loading at Elevated Temperaturs
Czech description
Tento člának se zabývá rázovými zkouškami pájeného spoje při zvýšených teplotách.

Publication year
2006
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Similar results(10)