Thermomechanical Analysis of Electrically Conductive Adhesives
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F10%3A00504856" target="_blank" >RIV/49777513:23220/10:00504856 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Thermomechanical Analysis of Electrically Conductive Adhesives
Original language description
Mechanical properties of isotropic electrically conductive adhesives (ICAs) are mainly influenced by their formulation and thermal processing. Thermomechanical analysis of ICAs was used with the goal to find influence of addition of two types of nanoparticles, silver nanoballs and carbon nanotubes, and two types of curing processes, on air and in vacuum, on the glass transition temperature and storage modulus of bisphenol epoxy adhesives filled with silver flakes (70 to 80 % by weight).
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Electronics System Integration Technology Conference ESTC 2010
ISBN
978-1-4244-8553-6
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
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Publisher name
IEEE
Place of publication
Piscataway, NJ
Event location
Berlín
Event date
Jan 1, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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