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Thermomechanical Analysis of Electrically Conductive Adhesives

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F10%3A00504856" target="_blank" >RIV/49777513:23220/10:00504856 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Thermomechanical Analysis of Electrically Conductive Adhesives

  • Original language description

    Mechanical properties of isotropic electrically conductive adhesives (ICAs) are mainly influenced by their formulation and thermal processing. Thermomechanical analysis of ICAs was used with the goal to find influence of addition of two types of nanoparticles, silver nanoballs and carbon nanotubes, and two types of curing processes, on air and in vacuum, on the glass transition temperature and storage modulus of bisphenol epoxy adhesives filled with silver flakes (70 to 80 % by weight).

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2010

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Electronics System Integration Technology Conference ESTC 2010

  • ISBN

    978-1-4244-8553-6

  • ISSN

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

  • Publisher name

    IEEE

  • Place of publication

    Piscataway, NJ

  • Event location

    Berlín

  • Event date

    Jan 1, 2010

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article