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Study of Thermomechanical Properties of One-and Two-Component Conductive Adhesives

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00219725" target="_blank" >RIV/68407700:21230/14:00219725 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Study of Thermomechanical Properties of One-and Two-Component Conductive Adhesives

  • Original language description

    The goal of this work was to find if the numer of components in one- and two-component conductive adhesives influences their thermomechanical properties. All adhesive used in this study were of an epoxy type filled with silver flakes and all had isotropic electrical conductivity. It was also found that all adhesives were not optimally cured through curing was carried out in accordance with recomendation of a producer of adhesives.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    V - Vyzkumna aktivita podporovana z jinych verejnych zdroju

Others

  • Publication year

    2014

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    37th Int. Spring Seminar on Electronics Technology

  • ISBN

    978-1-4799-4455-2

  • ISSN

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

  • Publisher name

    IEEE

  • Place of publication

    New York

  • Event location

    Drážďany

  • Event date

    May 7, 2014

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000346580500022