Study of Thermomechanical Properties of One-and Two-Component Conductive Adhesives
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00219725" target="_blank" >RIV/68407700:21230/14:00219725 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Study of Thermomechanical Properties of One-and Two-Component Conductive Adhesives
Original language description
The goal of this work was to find if the numer of components in one- and two-component conductive adhesives influences their thermomechanical properties. All adhesive used in this study were of an epoxy type filled with silver flakes and all had isotropic electrical conductivity. It was also found that all adhesives were not optimally cured through curing was carried out in accordance with recomendation of a producer of adhesives.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
V - Vyzkumna aktivita podporovana z jinych verejnych zdroju
Others
Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
37th Int. Spring Seminar on Electronics Technology
ISBN
978-1-4799-4455-2
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
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Publisher name
IEEE
Place of publication
New York
Event location
Drážďany
Event date
May 7, 2014
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000346580500022