Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F10%3A00173027" target="_blank" >RIV/68407700:21230/10:00173027 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive
Original language description
Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced by curing. Thermomechanical analysis allows to distinguish the point when the adhesive is fully cured, it may reveal a difference in mechanical properties after different modifications of the adhesive, it may give a clue to better thermal processing of the adhesive while curing. Thermal analysis of totally nine types of adhesive modifications was performed, particularly the influence of carbon nanotubes addition, silver nanoparticles and colloidal silver was observed. In our tests, both one-component and two-component adhesives were used.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
33rd International Spring Seminar on Electronics Technology
ISBN
978-1-4244-7849-1
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
10-13
Publisher name
IEEE
Place of publication
New York
Event location
Warsaw
Event date
May 12, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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