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Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F10%3A00173027" target="_blank" >RIV/68407700:21230/10:00173027 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive

  • Original language description

    Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced by curing. Thermomechanical analysis allows to distinguish the point when the adhesive is fully cured, it may reveal a difference in mechanical properties after different modifications of the adhesive, it may give a clue to better thermal processing of the adhesive while curing. Thermal analysis of totally nine types of adhesive modifications was performed, particularly the influence of carbon nanotubes addition, silver nanoparticles and colloidal silver was observed. In our tests, both one-component and two-component adhesives were used.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2010

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    33rd International Spring Seminar on Electronics Technology

  • ISBN

    978-1-4244-7849-1

  • ISSN

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

    10-13

  • Publisher name

    IEEE

  • Place of publication

    New York

  • Event location

    Warsaw

  • Event date

    May 12, 2010

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article