Capacitors Embedded in Photovia Substrates

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F11%3A43898268" target="_blank" >RIV/49777513:23220/11:43898268 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2011.6053541" target="_blank" >http://dx.doi.org/10.1109/ISSE.2011.6053541</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2011.6053541" target="_blank" >10.1109/ISSE.2011.6053541</a>

Result language
angličtina
Original language name
Capacitors Embedded in Photovia Substrates
Original language description
This paper deals with the photolithographic formation of embedded capacitors. The new composite photosensitive dielectric was developed and the whole manufacturing process for this dielectric was specified. The dielectric consists of photopolymer matrixand ceramic filler. The manufacturing process consists of screen printing processes and photolithography. Electrical parameters of manufactured embedded capacitors such as impedance to frequency characteristic or capacitance to filler weight amount characteristic were measured in detail and electrical parameters of embedded capacitors were calculated.
Czech name
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Czech description
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Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
34th Internatiobal Spring Seminar on Electronics Technology
ISBN
978-1-4577-2112-0
ISSN
2161-2528
e-ISSN
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Number of pages
5
Pages from-to
1-5
Publisher name
IEEE Service Center
Place of publication
445 Hoes Lane, Piscataway, NJ 08854, USA
Event location
Tatranská Lomnica
Event date
May 11, 2011
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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