A comparison of the shear strength of conductive adhesives and soldering alloys
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43925340" target="_blank" >RIV/49777513:23220/15:43925340 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7247983&newsearch=true&queryText=A%20comparison%20of%20the%20shear%20strength%20of%20conductive%20adhesives%20and%20soldering%20alloys" target="_blank" >http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7247983&newsearch=true&queryText=A%20comparison%20of%20the%20shear%20strength%20of%20conductive%20adhesives%20and%20soldering%20alloys</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2015.7247983" target="_blank" >10.1109/ISSE.2015.7247983</a>
Alternative languages
Result language
angličtina
Original language name
A comparison of the shear strength of conductive adhesives and soldering alloys
Original language description
This paper describes the influence of the cure schedule on the shear strength of the joint glued by EPO-TEK(R) H20S and 8331S. This work also describes the influence of solder alloy types on the shear strength of the solder joint. Joints were made by soldering and gluing of chip resistors 1206, 0805 and 0603 with different temperature profiles on rigid and flexible substrates. For soldering profiles were calculated heating factors. These profiles have an effect on the mechanical strength of the joint. Samples are measured after curing/soldering process by using shear strength test.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/ED2.1.00%2F03.0094" target="_blank" >ED2.1.00/03.0094: Regional Innovation Centre for Electrical Engineering (RICE)</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 2015 38th International Spring Seminar on Electronics Technology (ISSE 2015)
ISBN
978-1-4799-8860-0
ISSN
2161-2528
e-ISSN
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Number of pages
6
Pages from-to
1-6
Publisher name
IEEE
Place of publication
Piscataway
Event location
Eger, Maďarsko
Event date
May 6, 2015
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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