Influence of electrically conductive adhesive quantity on insulation distance and shear strength of glued joints
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F16%3A43928892" target="_blank" >RIV/49777513:23220/16:43928892 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/document/7563175/" target="_blank" >http://ieeexplore.ieee.org/document/7563175/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2016.7563175" target="_blank" >10.1109/ISSE.2016.7563175</a>
Alternative languages
Result language
angličtina
Original language name
Influence of electrically conductive adhesive quantity on insulation distance and shear strength of glued joints
Original language description
This article deals with the impact of electrically conductive adhesive quantity on the insulation distance and shear strength of joints glued by adhesives "MG 8331S" and Hysol CA3150" on rigid substrates FR-4. These joints were formed by adhesive bonding of chip resistors 0805. Nine different shapes of apertures in stencil were used for this experiment. These differences have an effect on the quantity of conductive adhesives which is used on the samples and an effect on the insulation distance between pads. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the effects of different shapes apertures in stencil and different quantities of adhesives on the mechanical strength of the joint and the insulation distance between pads.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/LO1607" target="_blank" >LO1607: RICE - New technologies and concepts for smart industrial system</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the International Spring Seminar of Electronics Technology (ISSE 2016)
ISBN
978-1-5090-1389-0
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
134-139
Publisher name
IEEE
Place of publication
Piscataway
Event location
Pilsen, Czech Republic
Event date
May 18, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000387089800026