Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43958055" target="_blank" >RIV/49777513:23220/19:43958055 - isvavai.cz</a>

Result on the web

<a href="http://147.228.94.30/images/PDF/Rocnik2019/Cislo2_2019/r13c2c4.pdf" target="_blank" >http://147.228.94.30/images/PDF/Rocnik2019/Cislo2_2019/r13c2c4.pdf</a>

DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs

Original language description

This paper deals with the influence of different apertures shape in stencil on mechanical shear strength, electrical resistance and insulation distance. In the experiment, the SMD chip components 0805 were assembled on flexible substrate by electrically conductive adhesives (MG 8331S, CA 3150). Six different shapes of apertures in stencil were used for this experiment. These differences have an effect on the quantity of conductive adhesives which is used on the samples and an effect on the insulation distance between pads. The half of samples was measured directly (electrical resistance, mechanical strength and insulation distance) and second half of samples was submitted to the accelerated ageing test (85°C/85%RH/16hrs) and then tested the same way. The results shows that it is appropriate to choose other aperture shape in stencil than standard rectangular shape.

Czech name

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Czech description

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Type

J_ost - Miscellaneous article in a specialist periodical

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2019

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Electroscope

ISSN

1802-4564

e-ISSN

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Volume of the periodical

2019

Issue of the periodical within the volume

2

Country of publishing house

CZ - CZECH REPUBLIC

Number of pages

6

Pages from-to

1-6

UT code for WoS article

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EID of the result in the Scopus database

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