Shear strength of conductive adhesive joints on rigid and flexible substrates depending on adhesive quantity

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F16%3A43928949" target="_blank" >RIV/49777513:23220/16:43928949 - isvavai.cz</a>
Result on the web
<a href="http://iris.elf.stuba.sk/cgi-bin/jeeec?act=pr&no=3_116" target="_blank" >http://iris.elf.stuba.sk/cgi-bin/jeeec?act=pr&no=3_116</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1515/jee-2016-0025" target="_blank" >10.1515/jee-2016-0025</a>

Result language
angličtina
Original language name
Shear strength of conductive adhesive joints on rigid and flexible substrates depending on adhesive quantity
Original language description
This article deals with the impact of electrically conductive adhesive quantity on the shear strength of joints glued by adhesives "EPO-TEK(R) H20S" and "MG8331S" on three types of substrates (FR-4, MELINEX(R)ST504, DuPontTM Pyralux(R)AC). These joints were made by gluing chip resistors 1206, 0805 and 0603, with two curing pro?les for each adhesive. Di?erent thicknesses of stencil and reductions in the size of the hole in stencils were used for this experiment. These di?erences have an e?ect on the quantity of conductive adhesives which must be used on the samples. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the e?ects of di?erent curing pro?les, various types of substrates, and di?erent quantities of adhesives on the mechanical strength of the joint.
Czech name
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Czech description
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Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Project
<a href="/en/project/LO1607" target="_blank" >LO1607: RICE - New technologies and concepts for smart industrial system</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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