Bending endurance of printed conductive patterns on flexible substrates
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F16%3A43928896" target="_blank" >RIV/49777513:23220/16:43928896 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/document/7563185/" target="_blank" >http://ieeexplore.ieee.org/document/7563185/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2016.7563185" target="_blank" >10.1109/ISSE.2016.7563185</a>
Alternative languages
Result language
angličtina
Original language name
Bending endurance of printed conductive patterns on flexible substrates
Original language description
This paper presents a research focused on the testing of flexible and printed components' mechanical properties. The flexibility and the bending endurance are the crucial properties for the production of smart labels and tags for smart packages. For these reasons, the presented research was concentrated on the development of bend test apparatus, as well as, on the specification and optimization of testing procedures. These procedures were verified on specially designed conductive test patterns manufactured by the use of three different technologies - standard flexible PCB manufacturing, screen printing of Ag pastes and Aerosol Jet(R) printing of Ag ink. Electrical parameters of test patterns were measured online and offline during the testing. The influences of test samples' electrical resistance on the number of bend cycles for different bending radiuses are described in this paper.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the International Spring Seminar of Electronics Technology (ISSE 2016)
ISBN
978-1-5090-1389-0
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
184-188
Publisher name
IEEE
Place of publication
Piscataway
Event location
Pilsen, Czech Republic
Event date
May 18, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000387089800036