Temperature stable solder pastes - properties and reliability

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F16%3A43930417" target="_blank" >RIV/49777513:23220/16:43930417 - isvavai.cz</a>
Result on the web
<a href="http://147.228.94.30/index.php?option=com_content&view=article&id=476:temperature-stable-solder-pastes-properties-and-reliability&catid=59:2016-12-12-09-18-59&Itemid=56" target="_blank" >http://147.228.94.30/index.php?option=com_content&view=article&id=476:temperature-stable-solder-pastes-properties-and-reliability&catid=59:2016-12-12-09-18-59&Itemid=56</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Temperature stable solder pastes - properties and reliability
Original language description
This article deals with one of the newest trends in soldering that means a using of the temperature stable solder pastes. These pastes do not need to be stored in fridge and do not need to be tempered to the room temperature before their use. On the market, several brands of temperature stable solder pastes are available. The article describes designed and performed experiments which aim to verify the declared properties. The experiments were designed and performed according Design of Experiments methodology. The results and recommendation for practice are presented at the end of the article.
Czech name
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Czech description
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Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Project
<a href="/en/project/LO1607" target="_blank" >LO1607: RICE - New technologies and concepts for smart industrial system</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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