Optimization of solder paste quantity considering the properties of solder joints

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F17%3A43930925" target="_blank" >RIV/49777513:23220/17:43930925 - isvavai.cz</a>

Result on the web

<a href="http://www.emeraldinsight.com/doi/full/10.1108/SSMT-10-2016-0025" target="_blank" >http://www.emeraldinsight.com/doi/full/10.1108/SSMT-10-2016-0025</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1108/SSMT-10-2016-0025" target="_blank" >10.1108/SSMT-10-2016-0025</a>

Result language

angličtina

Original language name

Optimization of solder paste quantity considering the properties of solder joints

Original language description

Purpose – The purpose of this paper is to find an optimum between the quantity of solder paste and the desired properties of the soldered joint. A reduction of solder paste quantity is recognized as an opportunity to save money. On the other hand, the quantity of solder paste significantly influences the final properties of the soldered joint. The purpose is also to design recommendations for manufacturers of electronic assemblies. Design/methodology/approach – The processing of the paper was initiated by a literature review. The expert analysis was the next step. The result of analysis was a fishbone diagram. Subsequently, the experiment was designed. Seven types and three volume of solder pastes and two aperture shapes of the stencil were used. The measured parameters were mechanical strength, electrical resistance, voids area and intermetallic compound (IMC) thicknesses. The results of the experiment were evaluated and recommendations for practice were defined. Findings – The carried out research has confirmed the influence of solder paste quantity on the shear strength, electrical resistance, voids area and IMC thickness of solder joint. The article presents the results achieved for solders Sn42Bi58, Sn42Bi57.6Ag0.4, SnAg3.0Cu0.5, SnCu0.7Ag1.0NiGe, SnAg3.5Bi0.5In8.0 and Sn62.5Pb36.5Ag1.0. Reduction of solder paste quantity down to 74 per cent (i.e. one quarter of quantity) decreases mechanical shear strength less than 10 per cent. Recommendations relating to the optimal reduction of solder paste quantity have been designed for each solder paste. Originality/value – Contribution of the paper is impact assessment of solder paste quantity on the properties of the soldered joint. It was carried out a large number of experiments and measurements which verify this effect. Such a comprehensive overview of the results is not yet available in the literature. Recommendations for manufacturers of electronic assemblies are also the benefit of article.

Czech name

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Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

—

OECD FORD branch

20201 - Electrical and electronic engineering

Project

<a href="/en/project/LO1607" target="_blank" >LO1607: RICE - New technologies and concepts for smart industrial system</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year

2017

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Soldering &amp; Surface Mount Technology

ISSN

0954-0911

e-ISSN

—

Volume of the periodical

29

Issue of the periodical within the volume

1

Country of publishing house

GB - UNITED KINGDOM

Number of pages

8

Pages from-to

15-22

UT code for WoS article

000396464600004

EID of the result in the Scopus database

2-s2.0-85011112580