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Study of co-fired multilayer structures based on Thick Printed Copper technology

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43953408" target="_blank" >RIV/49777513:23220/19:43953408 - isvavai.cz</a>

  • Result on the web

    <a href="https://www.sciencedirect.com/science/article/pii/S0167577X1831992X" target="_blank" >https://www.sciencedirect.com/science/article/pii/S0167577X1831992X</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1016/j.matlet.2018.12.040" target="_blank" >10.1016/j.matlet.2018.12.040</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Study of co-fired multilayer structures based on Thick Printed Copper technology

  • Original language description

    This paper is focused on the study of co-fired multilayer structures realized by Thick Printed Copper (TPC) technology. TPC technology is used for the manufacturing of substrates for power applications and it enables simple manufacturing of multilayer structures. These structures usually consist of two copper films separated by a dielectric film which are commonly fired individually. Co-firing of these films can reduce production costs and time. It does not deteriorate electrical parameters. The influence of co-firing of different film combinations on the inner structure, electrical and mechanical parameters and also the changes of these parameters after aging and thermal cycling are described in this paper.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database

  • CEP classification

  • OECD FORD branch

    20501 - Materials engineering

Result continuities

  • Project

    Result was created during the realization of more than one project. More information in the Projects tab.

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2019

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Materials Letters

  • ISSN

    0167-577X

  • e-ISSN

  • Volume of the periodical

    238

  • Issue of the periodical within the volume

    1 March

  • Country of publishing house

    NL - THE KINGDOM OF THE NETHERLANDS

  • Number of pages

    4

  • Pages from-to

    313-316

  • UT code for WoS article

    000455472800079

  • EID of the result in the Scopus database

    2-s2.0-85058782319