Advanced application capabilities of thick printed copper technology
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955855" target="_blank" >RIV/49777513:23220/19:43955855 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.23919/EMPC44848.2019.8951789" target="_blank" >http://dx.doi.org/10.23919/EMPC44848.2019.8951789</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.23919/EMPC44848.2019.8951789" target="_blank" >10.23919/EMPC44848.2019.8951789</a>
Alternative languages
Result language
angličtina
Original language name
Advanced application capabilities of thick printed copper technology
Original language description
This paper is focused on the advanced capabilities of Thick Printed Copper (TPC) technology used for power electronic substrate manufacturing. TPC technology is based on screen printing of special copper pastes on ceramic substrates and its firing in a nitrogen atmosphere. This technology can be used as an alternative solution to conventional metallization techniques such as DBC or AMB and enables wide-range interconnection capabilities which cannot be realized with these conventional techniques. TPC interconnection capabilities include multilayer structures, copper plated vias and integrated passive components. Parameters and reliability of above-mentioned TPC structures after accelerated aging and thermal shock cycling are described in this paper.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 22nd Microelectronics and Packaging Conference (EMPC 2019)
ISBN
978-0-9568086-6-0
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscataway
Event location
Pisa, Italy
Event date
Sep 16, 2019
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
000532694100017