Copper-filled vias made by thick printed copper technology

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F20%3A43958754" target="_blank" >RIV/49777513:23220/20:43958754 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9121024" target="_blank" >https://ieeexplore.ieee.org/document/9121024</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9121024" target="_blank" >10.1109/ISSE49702.2020.9121024</a>

Result language
angličtina
Original language name
Copper-filled vias made by thick printed copper technology
Original language description
This paper is focused on copper-filled vias realized by prospective Thick Printed Copper (TPC) technology. TPC technology can be used for power electronics substrate manufacturing instead of conventional metallization techniques (DBC or AMB). This technology enables the realization of complex interconnection including multilayer circuits and copper-filled vias. Process of realization and properties of copper-plated vias are described in detail in this paper.
Czech name
—
Czech description
—

Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020
ISBN
978-1-72816-773-2
ISSN
—
e-ISSN
2161-2536
Number of pages
4
Pages from-to
1-4
Publisher name
IEEE
Place of publication
Piscaway
Event location
Web-based Conference, Demenovska, Slovakia
Event date
May 14, 2020
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000610543500044

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