Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955221" target="_blank" >RIV/49777513:23220/19:43955221 - isvavai.cz</a>

Alternative codes found

RIV/68407700:21230/19:00331512

Result on the web

<a href="https://link.springer.com/article/10.1007/s10854-019-00784-5" target="_blank" >https://link.springer.com/article/10.1007/s10854-019-00784-5</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/s10854-019-00784-5" target="_blank" >10.1007/s10854-019-00784-5</a>

Result language

angličtina

Original language name

Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly

Original language description

In our paper, the characterization of glass transition temperature (Tg) was performed for one- and two-component electrically conductive adhesive used in electronic joining technologies. Both adhesives were of the epoxy type with the silver filler. Dynamic mechanical analysis (DMA) was used to measure the Tg. The adhesives were modified with nanoparticles, namely, carbon nanotubes (concentration of 0.5 and 0.8% by weight) and silver nanoballs (2.5% by weight). The values of Tg were determined from the plot of the Tg δ parameter. Two types of environmental stresses were used for climatic aging: 125 °C/56% RH and 85 °C/85% RH. The aging of the samples at 125 °C and 56% RH caused increase Tg for all formulations. The cause of these changes is additional curing of adhesive. Aging in the combined climate 85 °C/85% RH caused a shift in Tg toward lower values for formulations based on the one-component adhesive modified by CNT and toward higher values for all other formulations. The major cause of the decrease in Tg was that CNT inhered the curing reactions and banned them from completion. In cases where Tg grew, glue hardening take place. DMA was performed to examine Tg of the samples. The DMA measurements were carried out up to 200 °C. Repeated DMA measurement confirmed that this measurement caused additional hardening and increase Tg for all samples. The results will contribute to the use of conductive adhesives with better quality and reliability in electronics manufacturing.

Czech name

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Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

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OECD FORD branch

20505 - Composites (including laminates, reinforced plastics, cermets, combined natural and synthetic fibre fabrics; filled composites)

Project

—

Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2019

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Journal of Materials Science: Materials in Electronics

ISSN

0957-4522

e-ISSN

—

Volume of the periodical

30

Issue of the periodical within the volume

5

Country of publishing house

NL - THE KINGDOM OF THE NETHERLANDS

Number of pages

13

Pages from-to

4895-4907

UT code for WoS article

000461168600058

EID of the result in the Scopus database

2-s2.0-85061500749