Sintering of printed Ag on ceramic substrates with the use of formic acid

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962018" target="_blank" >RIV/49777513:23220/21:43962018 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9467610" target="_blank" >https://ieeexplore.ieee.org/document/9467610</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467610" target="_blank" >10.1109/ISSE51996.2021.9467610</a>

Result language
angličtina
Original language name
Sintering of printed Ag on ceramic substrates with the use of formic acid
Original language description
This paper deals with joints creation on ceramic substrates with printed conductive patterns made from copper and silver. Sintering on the printed patterns is extremely specific because of porous structure, big grains, and glassy phase. Joints are created using pressureless sintering technology with silver-based nanoparticle paste and its sintering occurred in various atmosphere settings, using the air, formic acid or with the combination of both. Sintering is the most promising die-attach technique for power electronic devices. Presented paper deals with the process of sintering on the printed patterns, including deposition of the sintering paste, selecting, and defining correct temperature profiles. Different pre-process cleaning procedures were also applied. For evaluation, shear test showing mechanical strength and also x-ray images for advanced analysis of internal structure were used.
Czech name
—
Czech description
—

Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2021 44th International Spring Seminar on Electronics Technology : /proceedings/
ISBN
978-1-66541-477-7
ISSN
—
e-ISSN
2161-2536
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscaway
Event location
web-basec Conference, Bautzen, Germany
Event date
May 5, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853459100050

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