A Comparative Study of Silver Sintering Pastes for Die-Attach Applications: Microstructure, Mechanical Properties, and Reliability
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F25%3A43976262" target="_blank" >RIV/49777513:23220/25:43976262 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/11222544" target="_blank" >https://ieeexplore.ieee.org/document/11222544</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.23919/EMPC63132.2025.11222544" target="_blank" >10.23919/EMPC63132.2025.11222544</a>
Alternative languages
Result language
angličtina
Original language name
A Comparative Study of Silver Sintering Pastes for Die-Attach Applications: Microstructure, Mechanical Properties, and Reliability
Original language description
This paper is focused on a comparative study of silver sintering pastes for die-attach applications. Three different silver sintering paste from NBETech, Nano-join and Jufeng were used for the study. The quality and reliability of sintered joints between alumina ceramic substrates with printed silver conductive patterns and ceramic mock-up chips were evaluated. A detailed description of the experiments, boxplot diagrams with measured values of mechanical strength, X-ray scans, SEM images and metallographic cross-sections of all tested samples before and after the thermal shock cycling with analysis and recommendations are described in the paper.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/TQ15000029" target="_blank" >TQ15000029: Advanced technologies of thermomechanically resistant component interconnection for power applications</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2025
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC)
ISBN
978-1-73950-051-1
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscataway
Event location
Grenoble, France
Event date
Sep 16, 2025
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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