Analysis and Sintering Optimization of Nanoparticle Paste with High Silver Content
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F22%3A43965449" target="_blank" >RIV/49777513:23220/22:43965449 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9812812" target="_blank" >https://ieeexplore.ieee.org/document/9812812</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812812" target="_blank" >10.1109/ISSE54558.2022.9812812</a>
Alternative languages
Result language
angličtina
Original language name
Analysis and Sintering Optimization of Nanoparticle Paste with High Silver Content
Original language description
This paper deals with analysis, testing, and process optimization of new nanoparticle silvering paste with high silver content. Specifically, on ceramic substrates with printed conductive patterns created by thick film technology. Sintering is currently one of the most anticipated ways of connecting dies on substrates in power electronics field. Using ceramic substrates in combination with printed patterns brings out new challenges because of porous structure and ceramic specific attributes, especially when using presureless sintering as in this case. Presented paper is focused on analysis and comparison of structure and behaviour of the new nanoparticle paste with commercially available silver sintering pastes. Following step was initial testing with different deposition techniques and development of optimal sintering profile. After sintering examinations were also carried out. Shear test showing mechanical resilience, x-ray scanning for analysis of internal structure and stereoscopic analysis of sintered paste. Prolonging the temperature peak from 45 to 60 minutes and rising its temperature to 280°C shows better results in created joint. Higher shear strength was achieved together with more homogenous sintered structure. Lower porosity and presence of nanoparticles shows great potential for more homogenous, stable, and more resistive connection to mechanical separation.
Czech name
—
Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2022 45th International Spring Seminar on Electronics Technology : /proceedings/
ISBN
978-1-66546-589-2
ISSN
2161-2536
e-ISSN
2161-2536
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscaway
Event location
Vienna, Austria
Event date
May 11, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853642200055