In-situ monitoring method for curing of pastes used in printed electronics
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962020" target="_blank" >RIV/49777513:23220/21:43962020 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9467541" target="_blank" >https://ieeexplore.ieee.org/document/9467541</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467541" target="_blank" >10.1109/ISSE51996.2021.9467541</a>
Alternative languages
Result language
angličtina
Original language name
In-situ monitoring method for curing of pastes used in printed electronics
Original language description
In this paper, a method for in-situ monitoring of curing of materials for printed electronics applications is introduced. Materials for printed electronics in form of inks and pastes need to be cured after printing. Curing is an important post-printing process. Curing is often done at elevated temperatures. The presented method includes a printable layout for conductive inks. The layout represents a large-area application and can be easily inspected by microscopy. The method also includes a specially designed holding frame that holds samples in the air and connects them to the measuring device. During curing the electrical resistance of the printed layout is measured. Presented results show that the curing process can be optimized by changing curing parameters like temperature and time, which is critical for substrates with low heat resistance.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/EF16_026%2F0008382" target="_blank" >EF16_026/0008382: Carbon allotropes with rationalized nanointerfaces and nanolinks for environmental and biomedical applications</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2021 44th International Spring Seminar on Electronics Technology : /proceedings/
ISBN
978-1-66541-477-7
ISSN
—
e-ISSN
2161-2536
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscaway
Event location
web-basec Conference, Bautzen, Germany
Event date
May 5, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853459100011