Glutaric acid as a flux substitute for soldering on ceramic substrates

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F23%3A43968767" target="_blank" >RIV/49777513:23220/23:43968767 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/10168381" target="_blank" >https://ieeexplore.ieee.org/document/10168381</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE57496.2023.10168381" target="_blank" >10.1109/ISSE57496.2023.10168381</a>

Result language
angličtina
Original language name
Glutaric acid as a flux substitute for soldering on ceramic substrates
Original language description
This article deals with using glutaric acid as a flux substitute for soldering on ceramic substrates with conductive patterns created by thick printed copper technology (TPC). The main goal of the research was to create high quality connections by soldering on ceramic substrates, together with elimination of conventional flux from the process. Conventional flux brings additional expenses because of its difficult cleaning after the soldering process. Necessity of connecting large surface chips is becoming increasingly relevant due the rising demand for power electronics, but brings out several challenges, especially on ceramic substrates. Further in the article is discussed soldering process optimization, its enhancement by using formic acid vapours for additional wetting. X-ray analysis for voids and shear test for determining mechanical resistance were also performed. Results shows that using the glutaric acid as a flux substitute yield joints of similar quality on comparison to conventional flux, with high shear strength and low amount and size of the voids.
Czech name
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Czech description
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Publication year
2023
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology
ISBN
979-8-3503-3484-5
ISSN
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e-ISSN
2161-2528
Number of pages
4
Pages from-to
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Publisher name
IEEE
Place of publication
Piscaway
Event location
Timisoara, Romania
Event date
May 10, 2023
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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