The Effect of Oxide Reduction Using Formic Acid Vapours on The Thickness of The Conductive Layer
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43972537" target="_blank" >RIV/49777513:23220/24:43972537 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/10603787" target="_blank" >https://ieeexplore.ieee.org/document/10603787</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10603787" target="_blank" >10.1109/ISSE61612.2024.10603787</a>
Alternative languages
Result language
angličtina
Original language name
The Effect of Oxide Reduction Using Formic Acid Vapours on The Thickness of The Conductive Layer
Original language description
This paper deals with the effect of the formic acid vapours on the thickness and roughness of the conductive layer during oxide reduction process. To fully understand influence of the process is important for the main goal of the whole research, which is creation of high-quality connections by soldering while abandoning from conventional flux in the process. By not using the flux, cleaning and impurities issues can be fully avoided, thus increasing the quality and reducing the price of final products. Conductive layers thickness was analysed by laser confocal microscopy before and after controlled oxidation and afterward oxide reduction process. In the article are discussed several different scenarios that can occur when dealing with differently oxidized substrates, how to handle them, and the effect of differently setup cleaning profiles. Overall suitability of the usage of the formic acid vapours for cleaning of the oxidation of the copper conductive paths is stated.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology
ISBN
979-8-3503-8547-2
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
4
Pages from-to
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Publisher name
IEEE
Place of publication
Piscaway
Event location
Prague, Czech Republic
Event date
May 15, 2024
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001283808200037