Reliability Testing of Recycled SMD Components Reused in E-Textiles after Ageing by Washing Cycles

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F23%3A43970521" target="_blank" >RIV/49777513:23220/23:43970521 - isvavai.cz</a>

Result on the web

<a href="https://ieeexplore.ieee.org/document/10418384" target="_blank" >https://ieeexplore.ieee.org/document/10418384</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.23919/EMPC55870.2023.10418384" target="_blank" >10.23919/EMPC55870.2023.10418384</a>

Result language

angličtina

Original language name

Reliability Testing of Recycled SMD Components Reused in E-Textiles after Ageing by Washing Cycles

Original language description

This paper presents a method for recycling and reusing SMD chip components in e-textiles using a special contacting technique. The method involves using a UV-curable, non-conductive acrylic adhesive to connect SMD components onto electrically conductive textile stretchable ribbons. At the end of the product’s life-cycle, the components are removed from the ribbon and reused to manufacture new products. The recycling procedure involves several steps, including disassembly, inspection, cleaning, repair, and reassembly of components. The results of an experiment testing the electrical resistance of new and reused components after washing and drying cycles showed that electrical resistance of reused joints did not significantly deteriorate compared to new joints. The reused components maintain their functionality and performance, suffering no significant impairment. They perform comparably to new components, even after repeated washing and drying cycles. The method offers several benefits, including conservation of raw materials, minimization of waste,and reduction of production costs. It can also help mitigate component shortages. However, it is found that the suitability of this remanufacturing method varies with different types of components. Certain component types may be more susceptible to damage or even unsuitable for this method. The method is particularly beneficial for higher-value or components experiencing market shortages, demonstrating its potential to address urgent industry challenges while contributing to environmental sustainability.

Czech name

—

Czech description

—

Type

D - Article in proceedings

CEP classification

—

OECD FORD branch

20201 - Electrical and electronic engineering

Project

<a href="/en/project/TN02000067" target="_blank" >TN02000067: Future Electronics for Industry 4.0 and Medical 4.0</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2023

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

2023 24th European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)

ISBN

978-0-9568086-9-1

ISSN

—

e-ISSN

—

Number of pages

5

Pages from-to

—

Publisher name

IEEE

Place of publication

Piscataway

Event location

Cambridge, UK

Event date

Sep 11, 2023

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

—