SMD Components Recycling Procedure for Reuse in E-Textiles with Risk Analysis

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43969179" target="_blank" >RIV/49777513:23220/24:43969179 - isvavai.cz</a>

Result on the web

<a href="https://link.springer.com/chapter/10.1007/978-3-031-38165-2_114" target="_blank" >https://link.springer.com/chapter/10.1007/978-3-031-38165-2_114</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/978-3-031-38165-2_114" target="_blank" >10.1007/978-3-031-38165-2_114</a>

Result language

angličtina

Original language name

SMD Components Recycling Procedure for Reuse in E-Textiles with Risk Analysis

Original language description

This paper deals remanufacturing method for the reuse of adhesive bonded SMD components on stretchable textile ribbons for integration in e-textiles and its risk analysis. Nowadays, e-waste is an increasing problem in the world, and reducing this problem by using circular economy principles and reusing components is beneficial. In our research, the samples were submitted for accelerated ageing by dry heat and their quality was evaluated by the electrical resistance measurement. The recycling procedure was realized four times, and the mentioned risk analysis was realized before and after the experiment. The two main goals of our research were determined. The first goal was to demonstrate the applicability of our recycling procedure and the quality of samples with reused components after accelerated climatic ageing by dry heat. The second goal was to create and verify the risk analysis of our method and identify actions to mitigate the high and very high risks. The experiment showed that our recycling method is applicable several times without decreasing product quality. The results also present that reused samples are functional like new even after samples dry heat ageing. The risk analysis after the experiment showed seven high risks, which is necessary to solve primarily. These risk factors and actions to mitigate them are described in the paper.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2024

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Proceedings of FAIM 2023

ISBN

978-3-031-38164-5

ISSN

2195-4356

e-ISSN

2195-4364

Number of pages

11

Pages from-to

988-998

Publisher name

Springer Cham

Place of publication

Cham

Event location

Porto, Portugal

Event date

Jun 18, 2023

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

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