Recycling SMD Components for E-Textile Fabrication: A Salt Spray Ageing Study
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43973305" target="_blank" >RIV/49777513:23220/24:43973305 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/10712140" target="_blank" >https://ieeexplore.ieee.org/document/10712140</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ESTC60143.2024.10712140" target="_blank" >10.1109/ESTC60143.2024.10712140</a>
Alternative languages
Result language
angličtina
Original language name
Recycling SMD Components for E-Textile Fabrication: A Salt Spray Ageing Study
Original language description
In an era where electronic waste is a growing concern, this paper introduces a groundbreaking recycling and reuse methodology for SMD chip components in e-textiles, promising a sustainable future for the electronics industry. Our innovative technique harnesses a UV-curable acrylic adhesive to conductively affix SMD components onto the electrically conductive paths in the textile stretchable ribbons. In the method, the SMD component is pressed onto the conductive paths and fixed in the direct intimate contact with the mentioned adhesive. These joints can be easily detached at the end of their lifecycle. This process not only conserves raw materials and minimizes waste but also significantly cuts production costs. Through realized experimentation, we demonstrate that the electrical resistance of reused joints remains stable, showing no substantial degradation when compared to new joints, even after salt spray ageing. This finding confirms that the performance of reused components is on par with new ones (at least when used twice), thus ensuring reliability in practical applications. While the method's applicability varies across different component types, it is advantageous, particularly for high-value parts or those in short supply. Engage with our full article to explore how this technique can improve component lifecycle management and pave the way for a more sustainable electronics landscape.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)
ISBN
979-8-3503-9036-0
ISSN
2687-9700
e-ISSN
2687-9727
Number of pages
5
Pages from-to
—
Publisher name
IEEE
Place of publication
Piscataway
Event location
Berlín, Germany
Event date
Sep 11, 2024
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001340802800144