Towards Additively Manufactured Alumina Substrates for Printed Electronics Applications

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43972538" target="_blank" >RIV/49777513:23220/24:43972538 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/10604073" target="_blank" >https://ieeexplore.ieee.org/document/10604073</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10604073" target="_blank" >10.1109/ISSE61612.2024.10604073</a>

Result language
angličtina
Original language name
Towards Additively Manufactured Alumina Substrates for Printed Electronics Applications
Original language description
In this paper, the usability of 3D printed aluminum oxide ceramic, as a substrate for printed electronics is examined. The typical manufacturing process of ceramic substrates is based on the pressing or casting of ceramic green bodies followed by firing, which are problematic technologies for the realization of 3D-shaped electronics. Therefore, the fused filament fabrication method is utilized for the realization of the alumina substrate. The manufacturing process is closely examined and observations are reported. A sufficient resistivity of 3.79E10 14 Ω.cm was measured. Onto 3D printed substrates, conductive structures based on Ag-filled paste were printed using Direct-Write digital printing technology. The adhesion force of printed layers was 35 N.mm -2 . The usability of a 3D printed alumina for electronics was further demonstrated by full circuit realization with components assembly.
Czech name
—
Czech description
—

Project
<a href="/en/project/TN02000067" target="_blank" >TN02000067: Future Electronics for Industry 4.0 and Medical 4.0</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology
ISBN
979-8-3503-8547-2
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
5
Pages from-to
—
Publisher name
IEEE
Place of publication
Piscaway
Event location
Prague, Czech Republic
Event date
May 15, 2024
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001283808200065

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