Mechanical Strength of Aged Solder Joints: Impact of Plasma Treatment
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F25%3A43975936" target="_blank" >RIV/49777513:23220/25:43975936 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/11120910" target="_blank" >https://ieeexplore.ieee.org/document/11120910</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE65583.2025.11120910" target="_blank" >10.1109/ISSE65583.2025.11120910</a>
Alternative languages
Result language
angličtina
Original language name
Mechanical Strength of Aged Solder Joints: Impact of Plasma Treatment
Original language description
The reliability of solder joints, crucial for electronic assemblies, is influenced by factors including intermetallic compound (IMC) growth during aging and surface properties. This study investigated the impact of atmospheric plasma pre-treatment on the shear strength and IMC formation of aged (thermal aging and thermal shock) SAC305 solder joints on various PCB finishes (Cu, ImT, HASL, ENIG). Shear testing revealed that plasma treatment had a limited effect on mechanical strength under the applied test conditions. Fracture mode analysis indicated that failures predominantly occurred at the component’s lead metallization, suggesting that component quality was the limiting factor, masking potential effects of the plasma treatment applied to the PCB pads. Thermal shock aging was observed to be more detrimental to joint strength than thermal aging, particularly affecting the component-level integrity. IMC analysis showed expected growth with thermal aging. Plasma treatment had negligible impact on IMC thickness for ENIG finish, while an unexpected trend of reduced IMC thickness was observed for HASL finish, warranting further investigation. The study highlights the critical role of component robustness in reliability testing and suggests its potential to overshadow the influence of PCB surface treatments.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2025
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2025 International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3315-1216-3
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
6
Pages from-to
1-6
Publisher name
IEEE
Place of publication
Piscaway
Event location
Budapešť, Hungary
Event date
May 14, 2025
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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