Reusing SMD Components on E-textiles: An Ageing Study by Combination of Corrosive Gases and Washing

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F25%3A43976261" target="_blank" >RIV/49777513:23220/25:43976261 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/11222437" target="_blank" >https://ieeexplore.ieee.org/document/11222437</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.23919/EMPC63132.2025.11222437" target="_blank" >10.23919/EMPC63132.2025.11222437</a>

Result language
angličtina
Original language name
Reusing SMD Components on E-textiles: An Ageing Study by Combination of Corrosive Gases and Washing
Original language description
The growing demand for sustainable practices in the electronics industry has led to the exploration of circular economy principles, particularly in e-textiles. This study investigates the feasibility of reusing surface-mount device (SMD) components integrated into conductive textile ribbons under conditions simulating real-life degradation. Using accelerated aging tests involving exposure to corrosive gases and washing cycles, we evaluated the durability of electrical connections and conductive paths. Results show that SMD components can be reused across multiple life cycles with minimal performance loss, while conductive ribbons exhibit degradation primarily during washing. Protective measures, such as seam-sealing adhesive tape, were effective against environmental pollutants but less so against detergent infiltration during washing. A novel remanufacturing process was employed to extract, clean, and reattach SMD components, demonstrating their viability for reuse without compromising quality. This research highlights the potential for sustainable etextile manufacturing by enabling component reuse and reducing electronic waste.
Czech name
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Czech description
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Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2025
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC)
ISBN
978-1-73950-051-1
ISSN
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e-ISSN
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Number of pages
7
Pages from-to
1-7
Publisher name
IEEE
Place of publication
Piscataway
Event location
Grenoble, France
Event date
Sep 16, 2025
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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