Hard alloy films with enhanced resistance to cracking

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23520%2F20%3A43960447" target="_blank" >RIV/49777513:23520/20:43960447 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Hard alloy films with enhanced resistance to cracking
Original language description
The work reports on the mechanical properties of alloy films prepared by magnetron sputtering. It is known that alloy films easily crack due to a low ratio H/E* < 0.1; here H is the hardness and E* is the effective Young’s modulus of the film. Cracking is a great drawback of alloy films as it strongly limits many of their practical applications. Therefore, it is important to develop new advanced alloy films with high hardness and enhanced resistance to cracking and that is the subject of the present investigation. It is shown that hard alloy films resistant to cracking must exhibit a high ratio H/E* ≥ 0.1, elastic recovery We > 60 %, compressive macrostress (σ < 0) and dense, voids-free microstructure. Deposition conditions under which such alloy films can be formed are given and mechanical properties of the Si-based hard alloy films with enhanced resistance to cracking are provided as examples.
Czech name
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Czech description
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Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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