Measurement of mechanical properties of lead free alloy

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27230%2F18%3A10241213" target="_blank" >RIV/61989100:27230/18:10241213 - isvavai.cz</a>
Result on the web
<a href="http://experimentalni-mechanika.cz/konference/konference/2018.html?download=1438:measurement-of-mechanical-properties-of-lead-free-solder" target="_blank" >http://experimentalni-mechanika.cz/konference/konference/2018.html?download=1438:measurement-of-mechanical-properties-of-lead-free-solder</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Measurement of mechanical properties of lead free alloy
Original language description
This paper describes main results of research focused on mechanical testing of Sn-3.5Ag-0.75Cu solder. Creep, tensile and torsional properties were investigated. The plastic behavior of the material can be studied in the most effective way under pure torsion. The viscoplastic behavior with high sensitivity on strain rate as well as temperature was observed. The results will be subsequently used for the calibration of appropriate constitutive law of the lead free solder.
Czech name
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Czech description
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Publication year
2018
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Experimental Stress Analysis : 56th international scientific conference : June 5th - June 7th, 2018, Harrachov, Czech Republic : conference proceedings : full text of papers
ISBN
978-80-270-4062-9
ISSN
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e-ISSN
neuvedeno
Number of pages
8
Pages from-to
1-8
Publisher name
Czech Society for Mechanics
Place of publication
Praha
Event location
Harrachov
Event date
Jun 5, 2018
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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