Modeling the self-annealing in electroplated copper films

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F04%3A00010137" target="_blank" >RIV/61989100:27360/04:00010137 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Modeling the self-annealing in electroplated copper films

Original language description

A simple phenomenological model describing experimentally observed self-annealing in copper thin films at room temperature was developed. The model proposes that the rate of grain size evolution depends primarily on the initial grain size of the as-deposited film and that the observed abnormal grain growth is viable only after desorption of incorporated additives. By calibrating to the measured data, the model has predictive capabilities for the normalized resistivity evolution of thin copper films usedin the semiconductor industry.

Czech name

měděné spoje, tenké vrstvy, strukturní změny

Czech description

měděné spoje, tenké vrstvy, strukturní změny

Type

D - Article in proceedings

CEP classification

JG - Metallurgy, metal materials

OECD FORD branch

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Project

<a href="/en/project/GP101%2F03%2FP165" target="_blank" >GP101/03/P165: Microstructure evolution of electroplated copper thin films for on-chip interconnections near room temperature</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2004

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Zeszyty Naukowe, Mechanika

ISBN

1429-6065

ISSN

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e-ISSN

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Number of pages

6

Pages from-to

73-78

Publisher name

Politechnika Opolska

Place of publication

Opole

Event location

Rožnov pod Radhoštěm

Event date

Dec 30, 2004

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

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