Abnormal grain growth in electrochemically deposited Cu films
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F04%3A00010186" target="_blank" >RIV/61989100:27360/04:00010186 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Abnormal grain growth in electrochemically deposited Cu films
Original language description
Cu interconnects are essential in advanced integrated circuits to minimize the RC delay. In manufacturing these devices, Cu is deposited electrochemically using a plating bath containing organic additives. The as-deposited nanocrystalline Cu films undergo self-annealing at room temperature to form a micronsized grain structure by abnormal grain growth. Systematic experimental studies of self-annealing kinetics on model Cu films deposited on a Au substrate suggest that the rate of grain size evolution depends primarily on the initial grain size of the as-deposited film. A model for the observed abnormal grain growth process is proposed. Assuming that desorption of the organic additives leads to mobile grain boundaries, the onset of abnormal grain growthis attributed to a sufficiently low additive concentration such that a full coverage of all grain boundaries cannot be maintained. The incubation time of abnormal growth is then a logarithmic function of the initial grain size. The proba
Czech name
Abnormální růst zrna v elektrochemicky nanášených vrstvách mědi.
Czech description
Abnormální růst zrna v elektrochemicky nanášených vrstvách mědi.
Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JG - Metallurgy, metal materials
OECD FORD branch
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Result continuities
Project
<a href="/en/project/GP101%2F03%2FP165" target="_blank" >GP101/03/P165: Microstructure evolution of electroplated copper thin films for on-chip interconnections near room temperature</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2004
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Materials Science Forum
ISSN
0-87849-952-0
e-ISSN
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Volume of the periodical
467-470
Issue of the periodical within the volume
2
Country of publishing house
CH - SWITZERLAND
Number of pages
6
Pages from-to
1339-1344
UT code for WoS article
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EID of the result in the Scopus database
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