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Silicon p-i-n photodiode with reduced crystallographic defect density and structured surface

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F67985882%3A_____%2F25%3A00619143" target="_blank" >RIV/67985882:_____/25:00619143 - isvavai.cz</a>

  • Result on the web

    <a href="https://doi.org/10.1088/1361-6463/adbd4d" target="_blank" >https://doi.org/10.1088/1361-6463/adbd4d</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1088/1361-6463/adbd4d" target="_blank" >10.1088/1361-6463/adbd4d</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Silicon p-i-n photodiode with reduced crystallographic defect density and structured surface

  • Original language description

    This paper reports new methods for reducing the density of structural defects on the surfaces of silicon p-i-n photodiodes (PDs). We experimentally proved that removing the silicon layer with packing defects, which are formed during oxidation, significantly contributes to reducing the density of the dislocations generated after phosphorus diffusion. Compared with the classical diffusion-planar technology for the preparation of silicon-based p-i-n PDs, our methods improve the parameters of PDs, especially dark current, sensitivity, noise equivalent power etc. Removal of the silicon layer is realized by carrying out chemical-dynamic polishing of the wafers after thermal oxidation in the areas of responsive elements. Although the optimum thickness of the etched silicon layer is about 2 mu m, which corresponds to an etching time of 30 s, even taking into account the fact that the detector properties will deteriorate with increasing etching time, the change in the 'maximum spectral response' is positive. It is demonstrated that the chemical-dynamic polishing is a powerful tool to modify spectral characteristics of PD sensitivity. The maximum of the spectral response can be accurately tailored in a wide spectral range from by changing the chemical-dynamic polishing parameters

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2025

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Journal of Physics D-Applied Physics

  • ISSN

    0022-3727

  • e-ISSN

    1361-6463

  • Volume of the periodical

    58

  • Issue of the periodical within the volume

    16

  • Country of publishing house

    US - UNITED STATES

  • Number of pages

    12

  • Pages from-to

    165106

  • UT code for WoS article

    001444333900001

  • EID of the result in the Scopus database

    2-s2.0-105000024565