Current Problems in Lead-free Soldering, Materials for High-Temperature Lead-free Solders
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F11%3A00370059" target="_blank" >RIV/68081723:_____/11:00370059 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Current Problems in Lead-free Soldering, Materials for High-Temperature Lead-free Solders
Original language description
In industry(especially in electronics), there is now increasing pressure to eliminate lead containing materils. A number of promising materials, for example, SnAgCu-alloys have been developed as replacement for the (near-)eutectic Sn-Pb solders in mainstream applications. The current situation especially in the field of lead free soldering at higher temperatures(mainly between 230-350°C)will be descriebed here.
Czech name
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Czech description
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Classification
Type
O - Miscellaneous
CEP classification
BJ - Thermodynamics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů