All

What are you looking for?

All
Projects
Results
Organizations

Quick search

  • Projects supported by TA ČR
  • Excellent projects
  • Projects with the highest public support
  • Current projects

Smart search

  • That is how I find a specific +word
  • That is how I leave the -word out of the results
  • “That is how I can find the whole phrase”

Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F12%3A00386299" target="_blank" >RIV/68081723:_____/12:00386299 - isvavai.cz</a>

  • Result on the web

    <a href="http://dx.doi.org/10.1007/s11665-012-0125-3" target="_blank" >http://dx.doi.org/10.1007/s11665-012-0125-3</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1007/s11665-012-0125-3" target="_blank" >10.1007/s11665-012-0125-3</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

  • Original language description

    The substitution of lead in the electronics industry is one of the key issues in the current drive towards ecological manufacturing. Legislation has already banned the use of lead in solders for mainstream applications (T M 220 °C), but the use of lead in the solders for high-temperature applications (>85% lead, T M 250-350 °C) is still exempt in RoHS2. The search for proper substitutes has been ongoing among solder manufacturers only for a decade without finding a viable low cost alternative and is thesubject of intensive research. This article tries to map the current situation in the field of high-temperature lead-free soldering, presenting a short review of current legislation, requirements for substitute alloys, and finally it describes some existing solutions both in the field of promising new materials and new technologies. Currently, there is no drop-in replacement for lead-containing solders and therefore both the new materials and the new technologies may be viable solutions

  • Czech name

    —

  • Czech description

    —

Classification

  • Type

    J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

  • CEP classification

    BJ - Thermodynamics

  • OECD FORD branch

    —

Result continuities

  • Project

    —

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2012

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Journal of Materials Engineering and Performance

  • ISSN

    1059-9495

  • e-ISSN

    —

  • Volume of the periodical

    21

  • Issue of the periodical within the volume

    5

  • Country of publishing house

    US - UNITED STATES

  • Number of pages

    9

  • Pages from-to

    629-637

  • UT code for WoS article

    000303455900010

  • EID of the result in the Scopus database

    —