Lead-Free Soldering: Environmentally Friendly Electronics

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F16%3A00463277" target="_blank" >RIV/68081723:_____/16:00463277 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1016/B978-0-12-411497-5.09996-3" target="_blank" >http://dx.doi.org/10.1016/B978-0-12-411497-5.09996-3</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/B978-0-12-411497-5.09996-3" target="_blank" >10.1016/B978-0-12-411497-5.09996-3</a>

Result language
angličtina
Original language name
Lead-Free Soldering: Environmentally Friendly Electronics
Original language description
The substitution of lead in the electronics industry is one of the key issues in the current drive toward ecological manufacturing. This chapter is aimed at giving an overview of requirements, current situation, problems, and possible development of lead-free soldering and other environmentally friendly joining technologies. It starts with the overview of existing EU regulations and directives. The current situation in the lead-free soldering field is mapped here and a review of the literature, including a patent search, reveals systems and technologies that are at the focus of research effort. New approaches that employ the use of theoretical modeling in the development of new materials is briefly discussed in this chapter.
Czech name
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Czech description
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Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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