All

What are you looking for?

All
Projects
Results
Organizations

Quick search

  • Projects supported by TA ČR
  • Excellent projects
  • Projects with the highest public support
  • Current projects

Smart search

  • That is how I find a specific +word
  • That is how I leave the -word out of the results
  • “That is how I can find the whole phrase”

Comparative study on dry etching of polycrystalline diamond thin films

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68378271%3A_____%2F12%3A00389069" target="_blank" >RIV/68378271:_____/12:00389069 - isvavai.cz</a>

  • Alternative codes found

    RIV/68407700:21340/12:00200427

  • Result on the web

    <a href="http://dx.doi.org/10.1016/j.vacuum.2011.07.023" target="_blank" >http://dx.doi.org/10.1016/j.vacuum.2011.07.023</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1016/j.vacuum.2011.07.023" target="_blank" >10.1016/j.vacuum.2011.07.023</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Comparative study on dry etching of polycrystalline diamond thin films

  • Original language description

    The reactive ion etching technique was used to etch diamond films. In this study we investigate the influence of process parameters (pressure, rf power, gas composition). The surface morphology of etched diamond films was characterized by SEM and the chemical composition of the etched film part was investigated by Raman Spectroscopy. We found that the gas composition had a crucial effect on the diamond film morphology. The use of CF4 gas resulted in flatter surfaces and lateral-like etching, while the use of pure O2 gas resulted in needle-like structures. Addition of argon to the reactant precursors increased the ion bombardment, which in turn increased the formation of non-diamond phases. Next, increasing the rf power from 100 to 500 W increased the etching rate from 5.4 to 8.6 ?m/h. In contrast to this observation, the rise of process pressure from 80 to 150 mTorr lowered the etching rate from 5.6 down to 3.6 ?m/h.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

  • CEP classification

    BM - Solid-state physics and magnetism

  • OECD FORD branch

Result continuities

  • Project

    Result was created during the realization of more than one project. More information in the Projects tab.

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2012

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Vacuum

  • ISSN

    0042-207X

  • e-ISSN

  • Volume of the periodical

    86

  • Issue of the periodical within the volume

    6

  • Country of publishing house

    GB - UNITED KINGDOM

  • Number of pages

    4

  • Pages from-to

    799-802

  • UT code for WoS article

    000301018400053

  • EID of the result in the Scopus database