Optimization of diamond growth on structured, soft and brittle substrates
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68378271%3A_____%2F20%3A00540749" target="_blank" >RIV/68378271:_____/20:00540749 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Optimization of diamond growth on structured, soft and brittle substrates
Original language description
Diamond has become an attractive material not only for fundamental research but also for industrial uses due to the extraordinary combination of its intrinsic properties. Its chemical vapor deposition is routinely done over the world on a large variety of substrates. However, the diamond high surface energy hinders its growth on foreign substrates. Therefore, optimizing the (pre-) growth technological step, known as nucleation or seeding step, is crucial to enhance the initial formation of diamond nuclei. Here, we present ultrasonic seeding and polymer-nanodiamond composite as promising nucleation techniques suitable for various substrates. The ultrasonic seeding is shown as a universal nucleation platform for nearly any substrate of complex and 3D-shape geometry. The complementary nucleation from polymer-nanodiamond is useful for the nucleation of soft and brittle materials.n
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
10302 - Condensed matter physics (including formerly solid state physics, supercond.)
Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 13th International Conference on Advanced Semiconductor Devices And Microsystems
ISBN
978-1-7281-9776-0
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
46-50
Publisher name
IEEE
Place of publication
New York
Event location
Smolenice
Event date
Oct 11, 2020
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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